STMicroelectronics EMIF06-HMC02F2
The EMIF06-HMC02F2 is a highly integrated array designed to suppress EMI / RFI noise for High Speed MultiMediaCard™ port filtering. The EMIF06-HMC02F2 Flip-Chip packaging means the package size is equal to the die size. Compared to EMIF06-HMC01F2, the EMIF06-HMC02F2 has its ground balls connected together internally.FEATURES
● 6 lines low-pass-filter● High efficiency in EMI filtering
● Very low PCB space consuming: < 4 mm²
● Lead-free package
● Very thin package: 0.65 mm
● High efficiency in ESD suppression
● High reliability offered by monolithic integration
● High reducing of parasitic elements through integration and wafer level packaging Complies with the following standards Datasheet - production data
DESCRIPTION
Additionally, this filter includes an ESD protection circuitry which prevents the protected device from destruction when subjected to ESD surges up to 15 kV. Figure 1. Pin configuration (ball side) $ % & ' Figure 2. Basic cell configuration 5 5 5 5 5 9PPF 00&FO N 00&FP G 00&GDW 00&GDW 00&GDW 00&GDW 9PPF 5 FO N 5 FP G 5 GDW 5 GDW 5 GDW 5 GDW● IEC 61000-4-2 level 4 on external pins – 15 kV (air discharge) – 8 kV (contact discharge)
● MIL STD 883E - Method 3015-6 Class 3
APPLICATIONS
● High Speed MultiMediaCard™ *1' Table 1. Ball configuration A1 cmd C1 dat2 A2 clk C2 gnd A3 Vmmc/Vdd C3 MMCdat1 A4 MMCclk C4 MMCdat0 B1 dat1 D1 dat3 B2 dat0 D2 gnd B3 gnd D3 MMCdat3 B4 MMCcmd D4 MMCdat2 TM: IPAD is a trademark of STMicroelectronics.