STMicroelectronics EMIF08-VID01F2
The EMIF08-VID01F2 is an 8 line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The flip chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15kV.DESCRIPTION
Benefits● High efficiency EMI filter (-33 dB @ 900 Mhz)
● Low line capacitance suitable for high speed data bus
● Low serial resistance for camera impedance adaptation
● Optimized PCB space consuming: 1.29 mm x 3.92 mm
● Very thin package: 0.65 mm
● Lead free pacakge
● High efficiency in ESD suppression on inputs pins (IEC61000-4-2 level 4).
● High reliability offered by monolithic integration
● High reducing of parasitic elements through integration & wafer level packaging. Lead free flip chip package Pin configuration (Bumps side) 12 11 10 9 8 7 6 5 4 3 2 1 I8 I7 I6 I5 I4 I3 I2 I1 A GGNNDD GGNNDD GGNNDD GGNNDD B O8 O7 O6 O5 O4 O3 O2 O1 C Complies with following standards: IEC61000-4-2 level 4 input pins 15 kV (air discharge) 8 kV (contact discharge level 1 output pins 2 kV (air discharge) 2 kV (contact discharge MIL STD 883E - Method 3015-6 Class 3 August 2005 Rev 2 1/6 6 1 Electrical characteristics (Tamb = 25°C) Figure 1. Basic cell configuration Input R EMIF08-VID01F2 Output R = 100 Ω Cline = 16 pF typ. @ 3 V Table 1.