STMicroelectronics ESDAULC6-3BP6
The ESDAULC6-3Bxx is a monolithic application specific discrete device dedicated to ESD protection of high speed interfaces such as USB2.0. The device is ideal for applications where both reduced print circuit board space and power absorption capability are required.| Part No. | ESDAULC6-3BP6 |
|---|---|
| Datasheet | ESDAULC6-3BP6 Download |
| Manufacturer |  STMicroelectronics |
| Description | ESD protection |
| Buy | Stock & Price |
FEATURES
● Ultra low capacitance 1.25 pF max.● Bi-directional protection
● RoHS package
DESCRIPTION
Benefits● Ultra low capacitance bidirectional ESD protection
● Low PCB space consumption: 2.5 mm2 max footprint (1.7 mm2 for Flip-Chip)
● Enhanced ESD protection: – 15 kV contact discharge – 15 kV air discharge
● No insertion loss to 3.0 GHz
● Ultra low leakage current
● High reliability offered by monolithic integration SOT-666 ESDAULC6-3BP6 Flip-Chip ESDAULC6-3BF2 Figure 1. I/O1 1 NC 2 I/O2 3 Functional diagram AB 6 GND 5 NC I/O1 GND 1 4 I/O3 I/O2 I/O3 2 Top view ESDAULC6-3BP6 Bump side view ESDAULC6-3BF2 Figure 2. Pin configuration I/O1 I/O2 I/O3 GND Table 1. Order codes Part number ESDAULC6-3BP6 ESDAULC6-3BF2 Marking 3 3B Complies with the following standards: IEC 61000-4-2 level 4: 8 kV (contact discharge) 15 kV (air discharge) MIL STD 883G-Method 3015-7: class 3B HBM (Human Body Model) July 2007 Rev 1 1/11 11 Characteristics 1 Characteristics ESDAULC6-3BP6, ESDAULC6-3BF2 Table 2.
