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ESDAULC6-3BP6 Datasheet Esd Protection

Manufacturer: STMicroelectronics

Overview: ESDAULC6-3BP6 ESDAULC6-3BF2 ESD protection for high speed interface Main applications Where transient overvoltage protection in ESD sensitive equipment is required, such as: ■ Computers ■ Printers ■ Communication.

General Description

The ESDAULC6-3Bxx is a monolithic application specific discrete device dedicated to ESD protection of high speed interfaces such as USB2.0.

The device is ideal for applications where both reduced print circuit board space and power absorption capability are required.

Benefits ■ Ultra low capacitance bidirectional ESD protection ■ Low PCB space consumption: 2.5 mm2 max footprint (1.7 mm2 for Flip-Chip) ■ Enhanced ESD protection: – 15 kV contact discharge – 15 kV air discharge ■ No insertion loss to 3.0 GHz ■ Ultra low leakage current ■ High reliability offered by monolithic integration SOT-666 ESDAULC6-3BP6 Flip-Chip ESDAULC6-3BF2 Figure 1.

Key Features

  • Ultra low capacitance 1.25 pF max.
  • Bi-directional protection.
  • RoHS package.

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