H32N65DM6 Description
This device bines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very pact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low coupled with an isolated top-side thermal pad.
H32N65DM6 Key Features
- AQG 324 qualified
- Half-bridge power module
- 650 V blocking voltage
- Fast recovery body diode
- Very low switching energies
- Low package inductance
- Dice on direct bond copper (DBC) substrate
- Low thermal resistance
- Isolation rating of 3.4 kVrms/min