Datasheet Details
| Part number | H32N65DM6 |
|---|---|
| Manufacturer | STMicroelectronics |
| File Size | 471.55 KB |
| Description | N-channel Power MOSFET |
| Datasheet |
 H32N65DM6 Datasheet
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|
|
| Part number | H32N65DM6 |
|---|---|
| Manufacturer | STMicroelectronics |
| File Size | 471.55 KB |
| Description | N-channel Power MOSFET |
| Datasheet |
H32N65DM6 Datasheet
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This device combines two MOSFETs in a half-bridge topology.
The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly.
Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad.