DESCRIPTION
OF ”B” SERIES CMOS DEVICES” EY (Plastic Package) F (Ceramic Frit Seal Package) M1 (Micro Package) C1 (Plastic Chip Carrier) ORDER CODES : HCC4041BF HCF4041BM1 HCF4041BEY HCF4041BC1 PIN CONNECTIONS DESCRIPTION
It can be used as an ultra-low power resistor-network driver for A/D and D/A conversion, as a transmission-line driver, and in other applications where high noise immunity and low-power dissipation are primary design requirements. June 1989 1/12 HCC/HCF4041UB FUNCTIONAL DIAGRAM ABSOLUTE MAXIMUM RATINGS
Symbol V DD* Vi II Pt ot Parameter Supply Voltage : HC C Types H C F Types Input Voltage DC Input Current (any one input) Total Power Dissipation (per package) Dissipation per Output Transistor for T o p = Full Package-temperature Range Operating Temperature : HCC Types H CF Types Storage Temperature Value – 0.5 to + 20 – 0.5 to + 18 – 0.5 to V DD + 0.5 ± 10 200 100 – 55 to + 125 – 40 to + 85 – 65 to + 150 Unit V V V mA mW mW °C °C °C Top Tstg Stresses above those listed under ”ABSOLUTE MAXIMUM RATINGS
” may cause permanent damage to the device.
STMicroelectronics
