STMicroelectronics LPS001D
The LPS001D is available in a small plastic land grid array (LGA) package, and is guaranteed to operate over a temperature range extending from -40 °C to +85 °C. The package is holed to allow external pressure to reach the sensing element. It includes a monolithic sensing element and an IC interface capable of taking information from the sensing element and providing a digital signal to external applications.| Part No. | LPS001D |
|---|---|
| Datasheet | LPS001D Download |
| Manufacturer |  STMicroelectronics |
| Description | MEMS Pressure Sensor |
| Buy | Stock & Price |
FEATURES
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● Piezoresistive pressure sensor Very low power consumption 300 -1100 mbar absolute pressure range 0.1 mbar resolution Embedded offset and span temperature compensation Embedded 16-bit ADC SPI and I2C interfaces Supply voltage: 2.2 V to 3.6 V 1.8 V compatible IOs High shock survivability (10000 g) Small, thin package ECOPACK® lead-free compliant The sensing element consists of a suspended membrane within a single monosilicon substrate, manufactured using a dedicated process developed by STMicroelectronics called “VENSENS”. The VENSENS process allows the construction of a monosilicon membrane above an air cavity with a controlled gap and defined pressure. The membrane is very small compared to traditional silicon micromachined membranes. Membrane breakage is prevented by intrinsic mechanical stoppers. The IC interface is manufactured using a standard CMOS process that allows a high level of integration, to design a dedicated circuit which is trimmed to better match the sensing element characteristics.
