DESCRIPTION
The decrease in operating power allows either a reduction of the size of the battery or an increase in the time between battery recharges. The FDIP28W (window ceramic frit-seal package) has a transparent lid which allows the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. PLCC32 (K) TSOP28 (N) 8 x 13.4mm Figure 1. Logic Diagram VCC VPP 15 A0-A14 8 Q0-Q7 Table 1. Signal Names A0-A14 Q0-Q7 E G VPP VCC VSS Address Inputs E G M27V256 Data Outputs Chip Enable Output Enable Program Supply Supply Voltage Ground VSS AI01908 May 1998 1/15 M27V256 Figure 2A. DIP Pin Connections Figure 2B. LCC Pin Connections AI01909 VSS DU Q3 Q4 Q5 AI01910 Warning: NC = Not Connected, DU = Dont’t Use. Figure 2C. TSOP Pin Connections For applications where the content is programmed only one time and erasure is not required, the M27V256 is offered in PDIP28, PLCC32 and TSOP28 (8 x 13.4 mm) packages.
STMicroelectronics
