DESCRIPTION
The decrease in operating power allows either a reduction of the size of the battery or an increase in the time between battery recharges. The FDIP28W (window ceramic frit-seal package) has transparent lid which allows the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. For applications where the content is programmed only one time and erasure is not required, the M27W512 is offered in PDIP28, PLCC32 and TSOP28 (8 x 13.4 mm) packages. VCC 16 A0-A15 8 Q0-Q7 E GVPP M27W512 VSS AI01584 March 2000 1/16 M27W512 Figure 2A. DIP Connections Figure 2B. LCC Connections AI02679 VSS DU Q3 Q4 Q5 AI01585 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 VSS 1 28 2 27 3 26 4 25 5 24 6 23 7 22 M27W512 8 21 9 20 10 19 11 18 12 17 13 16 14 15 VCC A14 A13 A8 A9 A11 GVPP A10 E Q7 Q6 Q5 Q4 Q3 A6 A5 A4 A3 A2 A1 A0 NC Q0 A7 A12 A15 DU VCC A14 A13 1 32 A8 A9 A11 NC GVPP A10 E Q7 Q6 9 M27W512 25 17 Q1 Q2 A0-A15 Q0-Q7 E GVPP VCC VSS NC DU Figure 2C.
STMicroelectronics
