DESCRIPTION
The decrease in operating power allows either a reduction of the size of the battery or an increase in the time between battery recharges. The FDIP32W (window ceramic frit-seal package) has a transparent lids which allow the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. For applications where the content is programmed only one time and erasure is not required, the M27W801 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages. VCC 20 A0-A19 8 Q0-Q7 E GVPP M27W801 VSS AI02363 April 2000 1/16 M27W801 Figure 2A. DIP Connections Figure 2B. PLCC Connections A19 A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 VSS 1 32 2 31 3 30 4 29 5 28 6 27 7 26 8 25 M27W801 9 24 10 23 11 22 12 21 13 20 14 19 15 18 16 17 AI02671 VCC A18 A17 A14 A13 A8 A9 A11 GVPP A10 E Q7 Q6 Q5 Q4 Q3 A7 A6 A5 A4 A3 A2 A1 A0 Q0 A12 A15 A16 A19 VCC A18 A17 1 32 A14 A13 A8 A9 A11 GVPP A10 E Q7 9 M27W801 25 17 VSS Q3 Q4 Q5 Q6 AI02365 Figure 2C.
STMicroelectronics
