STMicroelectronics M36L0R7060U1
This is preliminary information on a new product now in development or undergoing evaluation.M36L0R7060U1 M36L0R7060L1 M36L0R7050U1 M36L0R7050L1 128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package Preliminary Data Feature summary
● Multi-Chip Package – 1 die of 128 Mbit (8Mb x16, Mux I/O Multiple Bank, Multi-level, Burst) Flash Memory – 1 die of 32 or 64Mbit Mux I/O, Burst Pseudo SRAM Supply voltage – VDDF = VDDP = VDDQF = 1.7 to 1.95V – VPPF = 9V for fast program Electronic signature – Manufacturer Code: 20h – Device Codes (Top Flash Configuration): M36L0R7060U1: 882Eh, M36L0R7050U1: 882Eh – Device Codes (Bottom Flash Configuration) M36L0R7060L1: 882Fh M36L0R7050L1: 882Fh ECOPACK® package
● FBGA TFBGA88 (ZAM) 8 x 10mm
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● Dual operations – program/erase in one Bank while read in others – No delay between Read and Write operations Block locking – All blocks locked at power-up – Any combination of blocks can be locked with zero latency – WPF for Block Lock-Down – Absolute Write Protection with VPPF = VSS Comm...
● Multi-Chip Package – 1 die of 128 Mbit (8Mb x16, Mux I/O Multiple Bank, Multi-level, Burst) Flash Memory – 1 die of 32 or 64Mbit Mux I/O, Burst Pseudo SRAM Supply voltage – VDDF = VDDP = VDDQF = 1.7 to 1.95V – VPPF = 9V for fast program Electronic signature – Manufacturer Code: 20h – Device Codes (Top Flash Configuration): M36L0R7060U1: 882Eh, M36L0R7050U1: 882Eh – Device Codes (Bottom Flash Configuration) M36L0R7060L1: 882Fh M36L0R7050L1: 882Fh ECOPACK® package
● FBGA TFBGA88 (ZAM) 8 x 10mm
●
●
● Dual operations – program/erase in one Bank while read in others – No delay between Read and Write operations Block locking – All blocks locked at power-up – Any combination of blocks can be locked with zero latency – WPF for Block Lock-Down – Absolute Write Protection with VPPF = VSS Comm...