STMicroelectronics M69KB128AB
M69KB128AB IS ONLY AVAILABLE AS PART OF A MULTI-CHIP PACKAGE Wafer ■ ■ ■ ■ ■ July 2006 Rev 1 1/64 1 This is preliminary information on a new product now in development or undergoing evaluation.FEATURES
– Partial Array Self Refresh (PASR) – Deep Power-Down (DPD) Mode Operating Temperature – –30°C to +85°C Details are subject to change without notice. Contents M69KB128AB Contents 1 2 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1 2.2 2.3 2.4 2.5 Address Inputs (A0-A22) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Data Inputs/Outputs (DQ8-DQ15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Data Inputs/Outputs (DQ0-DQ7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Chip Enable (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Output Enable (G) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Write Enable (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .