Datasheet Summary
MEMS audio sensor high-performance analog bottom-port microphone
- production data
Description
The MP23AB02B is a pact, low-power microphone built with a low-profile sensing element. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors. RHLGA metal cap 3-lead 3.35 x 2.5 x 0.98 mm The MP23AB02B has an acoustic overload point of 125 dBSPL with a 64 dB signal-to-noise ratio. The MP23AB02B is available in a package pliant with reflow soldering and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
Features
- Single supply voltage operation
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