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MP23AB02B - MEMS audio sensor

Description

The MP23AB02B is a compact, low-power microphone built with a low-profile sensing element.

The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors.

Features

  • Single supply voltage operation.
  • Low power consumption.
  • Omnidirectional sensitivity.
  • High signal-to-noise ratio.
  • High bandwidth.
  • Package compliant with reflow soldering Table 1. Device summary Order code MP23AB02B MP23AB02BTR Temperature range (C) -40 to +85 -40 to +85 Package (3.35 x 2.5 x 0.98) mm (3.35 x 2.5 x 0.98) mm Packing Tray Tape and reel September 2014 This is information on a product in full production. DocID026104 Rev 3 1/12 www. st. com Pin descri.

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Datasheet Details

Part number MP23AB02B
Manufacturer STMicroelectronics
File Size 402.61 KB
Description MEMS audio sensor
Datasheet download datasheet MP23AB02B Datasheet
Additional preview pages of the MP23AB02B datasheet.

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Full PDF Text Transcription

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MP23AB02B MEMS audio sensor high-performance analog bottom-port microphone Datasheet - production data Description The MP23AB02B is a compact, low-power microphone built with a low-profile sensing element. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors. RHLGA metal cap 3-lead 3.35 x 2.5 x 0.98 mm The MP23AB02B has an acoustic overload point of 125 dBSPL with a 64 dB signal-to-noise ratio. The MP23AB02B is available in a package compliant with reflow soldering and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
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