STMicroelectronics SDIP30
SDIP30 Thermal Data
| Part No. | SDIP30 |
|---|---|
| Datasheet | SDIP30 Download |
| Manufacturer |  STMicroelectronics |
| Description | SDIP30 Thermal Data |
| Buy | Stock & Price |
Thermal Data SDIP 30 30 leads PACKAGE MATERIAL LIST item # leadframe die attach molding compound material copper epoxy glue ( silver filler ) epoxy resin thickness 0.25 mm 10-40 µm 3.8 mm thermal conductivity 2.61 W/cm°C 0.01 W/cm°C 0.0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time September 1999 1/2 Thermal Data Rth(j-a) (ºC/W) 75 1) 70 65 SDIP 30 die size 160x80 sq. mils mounted on a low K board (1s 1 Oz.) 80x80 sq. mils dissipating area 60 80x160 sq. mils dissipating area 55 0 0.5 1 1.5 2 2.5 dissipated power ( Watt ) Zth( ºC/W) 2) 10 die size 160x80 sq. mils 80x80 sq. mils dissipating area mounted on a low K board (1s 1 Oz.) 0.001 0.01 0.1 1 10 Time (s) 100 1,000 2/2
