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SDIP30 - SDIP30 Thermal Data

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Part number SDIP30
Manufacturer STMicroelectronics
File Size 53.16 KB
Description SDIP30 Thermal Data
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     Thermal Data www.DataSheet4U.com SDIP 30 30 leads PACKAGE MATERIAL LIST item # leadframe die attach molding compound material copper epoxy glue ( silver filler ) epoxy resin thickness 0.25 mm 10-40 µm 3.8 mm thermal conductivity 2.61 W/cm°C 0.01 W/cm°C 0.0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time September 1999 1/2 Thermal Data Rth(j-a) (ºC/W) 75 1) 70 65 SDIP 30 www.DataSheet4U.com die size 160x80 sq. mils mounted on a low K board (1s 1 Oz.) 80x80 sq. mils dissipating area 60 80x160 sq. mils dissipating area 55 0 0.5 1 1.5 2 2.5 dissipated power ( Watt ) Zth( ºC/W) 2) 10 die size 160x80 sq. mils 80x80 sq. mils dissipating area mounted on a low K board (1s 1 Oz.) 0.001 0.01 0.
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