STMicroelectronics SH68N65DM6AG
This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly.| Part No. | SH68N65DM6AG |
|---|---|
| Datasheet | SH68N65DM6AG Download |
| Manufacturer |  STMicroelectronics |
| Description | Automotive-grade N-channel 650V 64A Power MOSFET |
| Buy | Stock & Price |
FEATURES
Order code SH68N65DM6AG VDS 650 V RDS(on) max. 41 mΩ ID 64 A● AQG 324 qualified
● Half-bridge power module
● 650 V blocking voltage
● Fast recovery body diode
● Very low switching energies
● Low package inductance
● Dice on direct bond copper (DBC) substrate
● Low thermal resistance
● Isolation rating of 3.4 kVrms/min
APPLICATIONS
● Switching applicationsDESCRIPTION
Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches. Product status link SH68N65DM6AG Product summary Order code SH68N65DM6AG Marking H68N65DM6 Package ACEPACK SMIT Packing Tape and reel DS14027 - Rev 1 - July 2022 For further information contact your local STMicroelectronics sales office. SH68N65DM6AG Electrical ratings 1 Electrical ratings Table 1. Abso...
