STMicroelectronics SH70M12W3AG
The ACEPACK SMIT is a very compact surface mounted SiC MOSFET module. The SiC MOSFETs inside provide outstanding features, like very low on-resistance, fast switching, reduced parasitic, and robust body diode.| Part No. | SH70M12W3AG |
|---|---|
| Datasheet | SH70M12W3AG Download |
| Manufacturer |  STMicroelectronics |
| Description | 1200V 28A Automotive-grade SiC Power MOSFET |
| Buy | Stock & Price |
FEATURES
Order code SH70M12W3AG VDS 1200 V RDS(on) typ. 67 mΩ ID 28 A● AQG 324 qualified
● Half-bridge topology SiC MOSFET module
● 1200 V rated voltage
● Dice on direct bond copper (DBC) substrate
● SMD with insulated top side cooling
● Isolation voltage of 3.4 kVrms
● Low thermal resistance
● Package molding compound group I (CTI ≥ 600 V, 1000 Vrms in pollution degree 2)
APPLICATIONS
● DC/DC converter for EV/HEV● On board charger (OBC)
DESCRIPTION
Thanks to the DBC substrate, the ACEPACK SMIT package provides reliable insulation, a low thermal resistance and high flexibility, enabling several configurations. The half-bridge association can be used to build several topologies: totem pole PFC, full, and B6 bridges. Product status link SH70M12W3AG Product summary Order code SH70M12W3AG Marking SH70M12W3AG Package ACEPACK SMIT Packing Tape and reel DS14290 - Rev 6 - November 2024 For further information contact your local STMicroelectronics sales office. SH70M12W3AG Electrical ratings 1 Electrical ratings Table 1.
