SMB6F8.5A Datasheet | STMicroelectronics

Features - Peak pulse power: 600 W (10/1000 μs) and 4 k W (8/20 μs) - Flat and thin package: 1 mm - Stand-off voltage range from 5 V to 188 V - Unidirectional type - Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C - Operating Tj max: 175 °C - High power capability at Tj max.: up to 470 W (10/1000 µs) - Lead finishing: matte tin plating plies with the following standards - UL94, V0 - J-STD-020 MSL level 1 - J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 solderable matte tin plated leads - JESD-201 class 2 whisker test - IPC7531 footprint - JEDEC registered package outline - IEC 61000-4-4 level 4: - 4 k V - IEC 61000-4-2, C= 150 p F - R = 330 Ω exceeds level 4: - 30 k V (air discharge) - 30 k V (contact discharge) Description The SMB6Fxx A series are designed to protect sensitive circuits against surges. The Planar technology makes it patible with high-end circuits where low leakage current and high junction temperature are required to provide long term reliability and stability. DS12898 - Rev 3 - May 2019 For further information contact your local STMicroelectronics sales office. .st. SMB6Fxx A Characteristics...