STI7105 Overview
Key Specifications
Package: FBGA
Mount Type: Surface Mount
Pins: 620
Key Features
- Trench MOS Schottky technology
- Low forward voltage drop, low power losses
- High efficiency operation
- Meets MSL level 1, per J-STD-020C, LF max peak of 245 °C (for TO-263AB package)
- Solder dip 260 °C, 40 seconds (for TO-220AB, ITO-220AB & TO-262AA package)
