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STM32L452RE - Ultra-low-power Arm Cortex-M4 32-bit MCU+FPU

Download the STM32L452RE datasheet PDF (STM32L452CC included). The manufacturer datasheet provides complete specifications, pinout details, electrical characteristics, and typical applications for ultra-low-power arm cortex-m4 32-bit mcu+fpu.

Description

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17 3.1 Arm® Cortex®-M4 core with FPU

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Features

  • Ultra-low-power with FlexPowerControl.
  • 1.71 V to 3.6 V power supply.
  • -40 °C to 85/125 °C temperature range.
  • 145 nA in VBAT mode: supply for RTC and 32x32-bit backup registers.
  • 22 nA Shutdown mode (5 wakeup pins).
  • 106 nA Standby mode (5 wakeup pins).
  • 375 nA Standby mode with RTC.
  • 2.05 µA Stop 2 mode, 2.40 µA with RTC.
  • 84 µA/MHz run mode (LDO Mode).
  • 36 μA/MHz run mode (@3.3 V SMPS Mode).
  • Batch acqui.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (STM32L452CC-STMicroelectronics.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number STM32L452RE
Manufacturer STMicroelectronics
File Size 2.97 MB
Description Ultra-low-power Arm Cortex-M4 32-bit MCU+FPU
Datasheet download datasheet STM32L452RE Datasheet
Additional preview pages of the STM32L452RE datasheet.

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Other Datasheets by STMicroelectronics
  • STM32L452RC - Ultra-low-power Arm Cortex-M4 32-bit MCU+FPU
  • STM32L452CC - Ultra-low-power Arm Cortex-M4 32-bit MCU+FPU
  • STM32L452CE - Ultra-low-power Arm Cortex-M4 32-bit MCU+FPU
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Full PDF Text Transcription

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STM32L452xx Ultra-low-power Arm® Cortex®-M4 32-bit MCU+FPU, 100DMIPS, up to 512KB Flash, 160KB SRAM, analog, audio, ext. SMPS Datasheet - production data Features • Ultra-low-power with FlexPowerControl – 1.71 V to 3.6 V power supply – -40 °C to 85/125 °C temperature range – 145 nA in VBAT mode: supply for RTC and 32x32-bit backup registers – 22 nA Shutdown mode (5 wakeup pins) – 106 nA Standby mode (5 wakeup pins) – 375 nA Standby mode with RTC – 2.05 µA Stop 2 mode, 2.40 µA with RTC – 84 µA/MHz run mode (LDO Mode) – 36 μA/MHz run mode (@3.
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