STMicroelectronics STU14NA50
The Max220 TM package is a new high volume power package exibiting the same footprint as the industry standard TO-220, but designed to accomodate much larger silicon chips, normally supplied in bigger packages. The increased die capacity makes the device ideal to reduce component count in multiple paralleled TO-220 designs and save board space with respect to larger packages.| Part No. | STU14NA50 |
|---|---|
| Datasheet | STU14NA50 Download |
| Manufacturer |  STMicroelectronics |
| Description | N-Channel Enhancement Mode Fast Power MOS Transistor |
| Buy | Stock & Price |
DESCRIPTION
APPLICATIONS
s HIGH CURRENT, HIGH SPEED SWITCHING s SWITCH MODE POWER SUPPLIES (SMPS) s DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES (UPS)ABSOLUTE MAXIMUM RATINGS
Symbol V DS VDGR V GS ID ID I DM (● ) P tot T stg Tj Drain-source Voltage (V GS = 0) Gate-source Voltage Drain- gate Voltage (R GS = 20 k Ω ) Drain Current (continuous) at T c = 25 o C o m o .c U 4 t e e h S a t a .D w w w DS(on) 1 2 3 Max220TM INTERNAL SCHEMATIC DIAGRAM Parameter Value 500 Unit V V V 500 Drain Current (continuous) at T c = 100 C Drain Current (pulsed) Total Dissipation at T c = 25 C Derating Factor Storage Temperature Max. Operating Junction Temperature o (●) Pulse width limited by safe operating area October 1997 m o .c U 4 t e e h S a at .D w w w 14 A 8.8 56 A A 160 W 1.28 W/ o C o o ± 30 -65 to 150 150 C C 1/5 STU14NA50 THERMAL DATA R thj-case Rthj-amb R thc-sink Tl Thermal Resistance Junction-case Thermal Resistance Junction-ambient Thermal Resistance Case-sink...
