STMicroelectronics STU7NA80
The Max220TM package is a new high volume power package exibiting the same footprint as the industry standard TO-220, but designed to accomodate much larger silicon chips, normally supplied in bigger packages. The increased die capacity makes the device ideal to reduce component count in multiple paralleled TO-220 designs and save board space with respect to larger packages.DESCRIPTION
APPLICATIONS
s HIGH CURRENT, HIGH SPEED SWITCHING s SWITCH MODE POWER SUPPLIES (SMPS) s CONSUMER AND INDUSTRIAL LIGHTING s DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES (UPS)ABSOLUTE MAXIMUM RATINGS
Symbol Parameter VDS VDGR VGS ID ID IDM(●) Ptot Drain-source Voltage (VGS = 0) Drain- gate Voltage (RGS = 20 kΩ) Gate-source Voltage Drain Current (continuous) at Tc = 25 oC Drain Current (continuous) at Tc = 100 oC Drain Current (pulsed) Total Dissipation at Tc = 25 oC Derating Factor Tstg Storage Temperature Tj Max. Operating Junction Temperature (●) Pulse width limited by safe operating area June 1998 123 Max220TM INTERNAL SCHEMATIC DIAGRAM Value 800 800 ± 30 6.5 4.3 26 145 1.16 -65 to 150 150 Unit V V V A A A W W/oC oC oC 1/5 STU7NA80 THERMAL DATA Rthj-case Rthj-amb Rthc-sink TI Thermal Resistance Junction-case Thermal Resistance Junction-ambient Thermal Resistance Case-sink Maximum Lead Temperature For Soldering Purpose Max Max Typ 0.86 30 0.1 3...