STMicroelectronics STY15NA100
The Max247 TM package is a new high volume power package exibiting the same footprint as the industry standard TO-247, but designed to accomodate much larger silicon chips, normally supplied in bigger packages such as TO-264. The increased die capacity makes the device ideal to reduce component count in multiple paralleled designs and save board space with respect to larger packages.| Part No. | STY15NA100 |
|---|---|
| Datasheet | STY15NA100 Download |
| Manufacturer |  STMicroelectronics |
| Description | 1000V N-Channel Power MOSFET |
| Buy | Stock & Price |
DESCRIPTION
INTERNAL SCHEMATIC DIAGRAMAPPLICATIONS
s HIGH CURRENT, HIGH SPEED SWITCHING s SWITCH MODE POWER SUPPLIES (SMPS) s DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES (UPS)ABSOLUTE MAXIMUM RATINGS
Symbol V DS VDGR V GS ID ID I DM (● ) P tot T stg Tj Parameter Drain-source Voltage (V GS = 0) Drain- gate Voltage (R GS = 20 k Ω ) Gate-source Voltage Drain Current (continuous) at T c = 25 o C Drain Current (continuous) at T c = 100 C Drain Current (pulsed) Total Dissipation at T c = 25 C Derating Factor Storage Temperature Max. Operating Junction Temperature o o Value 1000 1000 ± 30 15 9.5 60 300 2.4 -55 to 150 150 Unit V V V A A A W W/ o C o o C C (●) Pulse width limited by safe operating area April 1998 1/5 STY15NA100 THERMAL DATA R thj-case R thj-amb R thc-sink Thermal Resistance Junction-case Thermal Resistance Junction-ambient Thermal Resistance Case-Heatsink with Conductive Grease Max Max Typ 0.42 40 0.05 o o C/W C/W AVALANCHE CHARACTERISTICS Symbo...
