STMicroelectronics TN1258
This note is intended to compare the PowerSO-20/36 with alternative surface mount solutions and to the existing Multiwatt package, the well known "double TO-220" developed by STMicroelectronics in late 70s.APPLICATIONS
with 1-2 Watt dissipation ............................................. 17 3.2.1 On board dissipating elements ......................................................... 17 3.3APPLICATIONS
with 2-5 W dissipation ................................................. 19 3.3.1 Dissipating elements and ground layer ............................................ 19 3.3.2 Via holes and ground layer............................................................... 19 3.3.3 Via holes and external heatsink ....................................................... 21 3.4 High power applications (up to 20 W) with standard substrate ....... 21 3.4.1 Slug-up package and external heatsink ........................................... 22 3.4.2 Cavity board and external heatsink .................................................. 24 3.5 High power applications (up to 20 W) with Insulated Metal Substrates (IMS) .......................................................................................... 24 3.6 High power pulses and thermal impedance ....................................