STMicroelectronics USBULC6-2F3
The USBULC6-2F3 is a monolithic, application specific discrete device dedicated to ESD protection of high speed interfaces. Its ultra low line capacitance secures a high level of signal integrity without compromizing the protection of downstream sensitive chips against the most stringently characterized ESD strikes.| Part No. | USBULC6-2F3 |
|---|---|
| Datasheet | USBULC6-2F3 Download |
| Manufacturer |  STMicroelectronics |
| Description | Dual ultra low capacitance protection |
| Buy | Stock & Price |
FEATURES
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● Ultra low diode capacitance (1.2 pF max) Two data lines (D+ and D-) protected against 15 kV ESD Breakdown Voltage VBR = 6.0 V min Flip-Chip 400 µm pitch, lead-free Very low leakage current Very small PCB area RoHS compliant Flip-Chip (4 Bumps) Pin configuration (bump side) A B 1 2
DESCRIPTION
Configuration A1 B1 Benefits●
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● Minimized impact on rise and fall times for maximum data integrity Low PCB space occupation Higher reliability offered by monolithic integration A2 B2 Note: B1 and B2 bumps must be grounded on the PCB together Complies with the following standards: IEC 61000-4-2: 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883G - Method 3015.7 25 kV (Human body model) Order code Part Number USBULC6-2F3 Marking EH TM: IPAD is a trademark of STMicroelectronics December 2006 Rev 1 1/8 Characteristics USBULC6-2F3 1 Characteristics Table 1. Symbol VPP PPP Tj Top Tstg
ABSOLUTE MAXIMUM RATINGS
(Tamb = 25° C) Parameter ESD discharge IEC 61000-4-2, air di...
