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VD55G0 Datasheet PDF

STMicroelectronics VD55G0

The VD55G0 is a global shutter image sensor with high BSI performance which captures up to 210 frames per second in a 644 x 604 resolution format. The pixel construction of this device minimizes crosstalk while enabling a high quantum efficiency (QE) in the near infrared spectrum. Technical specifications Feature Pixel resolution Sensor technology Pixel size Analog gain 60 fps Power consumption 30 fps 10 fps Junction temperature range (Tj) Shutter Package option Frame rate at full resolution CSI-2 serial interface data rate Pixel output format Supply voltages Temperature...
Part No. VD55G0
Datasheet VD55G0 Download
Manufacturer
STMicroelectronics
Description Advanced 644 x 604 pixel ultra compact sensor
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VD55G0 datasheet page 1 preview

DESCRIPTION

Bare die Application Engineered for high-performance computer vision applications, including AR/VR, personal and industrial robotics, drones, barcodes, biometrics and gestures, embedded vision or scene recognition. Typical use cases where highperformance near IR sensing is key. Demanding computer vision on scene with movement requiring no shutter artifacts.

FEATURES

● Global shutter technology, STMicroelectronics proprietary single layer
● 3D stacked sensor 40 nm/65 nm
● 2.61 µm x 2.61 µm BSI pixel with full CDTI (capacitive deep trench)
● High performance with excellent – QE (quantum efficiency) – MTF (modulation transfer function) up to near IR – Perfect PLS (shutter efficiency)
● Smallest sensor on market with: – Compact die size: 2.6 mm x 2.5 mm – 640 pixel x 600 pixel resolution – Very small pixel array, 1.67 mm x 1.57 mm – Optical format between 1/9 inch
● Operating junction temperature: -30°C to 85°C
● Single lane transmitter MIPI CSI-2 (copyright© 2005-2010 MIPI Alliance, Inc.
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