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VN03SP - HIGH SIDE SMART POWER SOLID STATE RELAY

General Description

o The VN03SP is a monolithic device made using s STMicroelectronics VIPower Technology, b intended for driving resistive or inductive loads O with one side grounded.

) - Built-in thermal shut-down protects the chip from t(s over temperature and short circuit.

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The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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® VN03SP HIGH SIDE SMART POWER SOLID STATE RELAY TYPE V N03 SP VDSS 60 V R DS ( o n ) 0.5 Ω In(*) 0.7 A VCC 26 V s MAXIMUM CONTINUOUS OUTPUT CURRENT (#):9 A @ Tc=85oC ) s 5 V LOGIC LEVEL COMPATIBLE INPUT t(s s THERMAL SHUT-DOWN s UNDER VOLTAGE PROTECTION uc s OPEN DRAIN DIAGNOSTIC OUTPUT d s INDUCTIVE LOAD FAST ro DEMAGNETIZATION P s VERY LOW STAND-BY POWER DISSIPATION lete DESCRIPTION o The VN03SP is a monolithic device made using s STMicroelectronics VIPower Technology, b intended for driving resistive or inductive loads O with one side grounded. ) - Built-in thermal shut-down protects the chip from t(s over temperature and short circuit.