STMicroelectronics VS6650
The VS6650 features allow straightforward integration into mobile phone designs: low EMI video interface and package/socket shielding, low wire count (8 total), embedded power management (30 µW power-down) and embedded PLL. The VS6650 3-element lens design ensures high quality image capture while maintaining low module height. The overall optical stack, including lens system, IR filter and sensor optical structures is developed within ST.FEATURES
● 1.0 Megapixel resolution (1152H x 864V)●
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● SMIA1 1.0 profile 1 compliant imager CCP 2.0 serial video interface Two-wire control port (CCI) On-chip PLL based on 13 MHz system clock Up to 30 frame per second (fps) progressive scan, with smooth frame rate control Horizontal downscale from 1x to 4.5x in 1/16 steps Operation from 2.4 V analog power supply Low EMI 1.8 V digital and I/O power supply 30 µW power-down consumption 10-bit on-chip ADC Small size 1/3 inch lens fixed focus module Integral EMC shielding A minimal list of external components is required: supply decoupling capacitors, CCI pull-ups and a chargepump capacitor. The VS6650 package uses the second generation of SmOP2 packaging technology. Sensor and lens are assembled in a fully automated test and focus process for high volume and low cost production. This 1.0 Megapixel sensor fits within the SMIA95 form factor (9.5 x 9.5 x 7.6 mm3).
APPLICATIONS
● Mobile phone●
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DESCRIPTION
The VS6650 is a 1.0 Megapixel camera module for use across a range of mobile phone platforms.