HY9N5BU
Features
:
- Ultra Low Capacitance 0.5 p F
- Low Clamping Voltage
- Small Body Outline Dimensions:
0.039″ x 0.024″ (1.00 mm x 0.60 mm)
- Low Body Height: 0.020″ (0.5 mm)
- Stand- off Voltage: 5 V
- Low Leakage
- Response Time is Typically < 1.0 ns
- IEC61000- 4- 2 Level 4 ESD Protection
- This is a Pb- Free Device
- S- Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable.
QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 61000- 4- 2 (ESD)
Contact Air
±8 k V
Total Power Dissipation on FR- 5 Board (Note 1) @ TA = 25°C
Storage Temperature Range
Junction Temperature Range
Lead Solder Temperature
- Maximum (10 Second Duration)
°PD°
Tstg TJ TL
150 m W
- 55 to +150 °C
- 55 to +125 °C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Remended Operating...
