KAG00J007M-FGG2 - MCP Memory

Datasheet Summary

Description

The KAG00J007M is a Multi Chip Package Memory which combines 512Mbit Nand Flash Memory(organized with two pieces of 256Mbit Nand Flash Memory) and 256Mbit synchronous high data rate Dynamic RAM.

Features

and specifications including FAQ, please refer to Samsung’s web site. http://samsungelectronics. com/semiconductors/products/products_index. html The attached datasheets are prepared and approved by.

Samsung Electronics

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Datasheet Details

Part number	KAG00J007M-FGG2
Manufacturer	Samsung Electronics
File Size	1.35 MB
Description	MCP Memory
Datasheet	KAG00J007M-FGG2 Datasheet
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www.DataSheet4U.com KAG00J007M-FGG2 Advance Preliminary MCP MEMORY MCP Specification of 256Mb NAND*2 and 256Mb Mobile SDRAM -1- Revision 0.6 October 2003 www.DataSheet4U.com KAG00J007M-FGG2 Document Title Advance Preliminary MCP MEMORY Multi-Chip Package MEMORY 256M Bit(32Mx8) Nand Flash*2 / 256M Bit(4Mx16x4Banks) Mobile SDRAM Revision History Revision No. History 0.0 Initial issue. (512M NAND DDP C-Die_ Ver 1.0) ( 256M MSDRAM E‘-Die_Ver 0.5) - Added Column address : page 37 - Changed the values of Icc - Inserted Commercial Temperature - Inserted DS 1/4 & 1/8 option in EMRS table. - Changed default DS from full size to half size.

Published: Mar 25, 2008 |