• Part: KAG00J007M-FGG2
  • Manufacturer: Samsung Electronics
  • Size: 1.35 MB
Download KAG00J007M-FGG2 Datasheet PDF
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KAG00J007M-FGG2 Key Features

  • Operating Temperature : -25°C ~ 85°C
  • Package : 107-ball FBGA Type
  • 10.5x13mm, 0.8mm pitch <NAND>
  • Power Supply Voltage : 2.4~2.9V
  • Organization
  • Memory Cell Array : (64M + 2048K)bit x 8bit
  • Data Register : (512 + 16)bit x 8bit
  • Automatic Program and Erase
  • Page Program : (512 + 16)Byte
  • Block Erase : (16K + 512)Byte

KAG00J007M-FGG2 Description

KAG00J007M-FGG2 Advance Preliminary MCP MEMORY MCP Specification of 256Mb NAND 2 and 256Mb Mobile SDRAM -1- Revision 0.6 October 2003 .. History 0.0 Initial issue. (512M NAND DDP C-Die_ Ver 1.0) ( 256M MSDRAM E‘-Die_Ver 0.5) - Added Column address.