KAG00J007M-FGG2 Overview
KAG00J007M-FGG2 Advance Preliminary MCP MEMORY MCP Specification of 256Mb NAND 2 and 256Mb Mobile SDRAM -1- Revision 0.6 October 2003 .. History 0.0 Initial issue. (512M NAND DDP C-Die_ Ver 1.0) ( 256M MSDRAM E‘-Die_Ver 0.5) - Added Column address.
KAG00J007M-FGG2 Key Features
- Operating Temperature : -25°C ~ 85°C
- Package : 107-ball FBGA Type
- 10.5x13mm, 0.8mm pitch <NAND>
- Power Supply Voltage : 2.4~2.9V
- Organization
- Memory Cell Array : (64M + 2048K)bit x 8bit
- Data Register : (512 + 16)bit x 8bit
- Automatic Program and Erase
- Page Program : (512 + 16)Byte
- Block Erase : (16K + 512)Byte