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KMM372F400CK - DRAM Module

General Description

The Samsung KMM372F40(1)0C is a 4Mx72bits Dynamic RAM high density memory module.

The Samsung KMM372F40(1)0C consists of eighteen CMOS 4Mx4bits DRAMs in SOJ/TSOP-II 300mil package, and two 16bits driver IC in 48pin TSSOP package mounted on a 168-pin glassepoxy substrate.

Key Features

  • Part Identification - KMM372F400CK (4096 cycles/64ms Ref. , SOJ) - KMM372F400CS (4096 cycles/64ms Ref. , TSOP) - KMM372F410CK (4096 cycles/32ms Ref. , SOJ) - KMM372F410CS (4096 cycles/32ms Ref. , TSOP).
  • Fast Page Mode with Extended Data Out Mode Operation.
  • CAS-before-RAS Refresh capability.
  • RAS-only and Hidden refresh capability.
  • TTL compatible inputs and outputs.
  • Single 3.3V±0.3V power supply.

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Other Datasheets by Samsung Semiconductor

Part Number Description
KMM372F400CS DRAM Module
KMM372F410CK DRAM Module
KMM372F410CS DRAM Module
KMM372F1600BK DRAM Module
KMM372F1600BS DRAM Module

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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DRAM MODULE KMM372F400CK/CS KMM372F410CK/CS KMM372F400CK/CS / KMM372F410CK/CS Fast Page with EDO Mode 4M x 72 DRAM DIMM with ECC using 4Mx4, 4K/2K Refresh, 3.3V GENERAL DESCRIPTION The Samsung KMM372F40(1)0C is a 4Mx72bits Dynamic RAM high density memory module. The Samsung KMM372F40(1)0C consists of eighteen CMOS 4Mx4bits DRAMs in SOJ/TSOP-II 300mil package, and two 16bits driver IC in 48pin TSSOP package mounted on a 168-pin glassepoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit board for each DRAM. The KMM372F40(1)0C is a Dual In-line Memory Module and is intended for mounting into 168-pin edge connector sockets. FEATURES • Part Identification - KMM372F400CK (4096 cycles/64ms Ref., SOJ) - KMM372F400CS (4096 cycles/64ms Ref.