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KMMR18R86C Datasheet PDF

Samsung Semiconductor KMMR18R86C

The following table lists the frequency and latency bins available from RIMM modules.
Part No. KMMR18R86C
Datasheet KMMR18R86C Download
Manufacturer
Samsung Semiconductor
Description SDRAM
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KMMR18R86C datasheet page 1 preview

FEATURES

♦ High speed 800 and 600MHz RDRAM storage ♦ 184 edge connector pads with 1mm pad spacing ♦ Maximum module PCB size : 133.5mm x 34.93mm x 96M x 16/18 -RG6 -RK8 -RM8 128M x 16/18 -RG6 -RK8 -RM8 1.37mm (5.21” x 1.375” x 0.05”) ♦ Each RDRAM has 32 banks, for a total of 512, 384, 256, 192, or 128 banks on each 256/288MB, 192/216MB, 128/144MB, 96/108MB, or 64/72MB module respectively ♦ Gold plated edge connector pad contacts ♦ Serial Presence Detect(SPD) support ♦ Operates from a 2.5 volt supply (±5%) ♦ Low power and powerdown self refresh modes ♦ Separate Row and Column buses for higher efficiency ♦ RDRAMs use µ−BGA package type a. -S designator is used for modules with lower self-refresh current. Form Factor The Rambus RIMM modules are offered in a 184-pad 1mm edge connector pad pitch form factor suitable for 184 contact RIMM connectors. The RIMM module is suitable for desktop and other system applications. Note: On two sided modules, RDRAMs are also installed on bottem side of PCB.
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