K4B1G0846C

Manufacturer: Samsung Semiconductor

K4B1G0846C datasheet by Samsung Semiconductor.

This datasheet includes multiple variants, all published together in a single manufacturer document.

K4B1G0846C Datasheet Details

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4 3.0 Package pinout/Mechanical Dimension & Addressing
5 3.1 x4 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls)
5 3.2 x8 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls)
6 3.3 x16 Package Pinout (Top view) : 112ball FBGA Package(96balls + 16 balls of support balls)
7 3.4 FBGA Package Dimension (x4)
8 3.5 FBGA Package Dimension (x8)
9 3.6 FBGA Package Dimension (x16)
10 4.0 Input/Output Functional Description

Samsung Electronics reserves the right to change products or specification without notice

Part Number	Description	Other Manufacturers
K4B1G0846E	1Gb E-die DDR3 SDRAM	Samsung
K4B1G0846F	1Gb F-die DDR3 SDRAM	Samsung
K4B1G0846G	1Gb G-die DDR3 SDRAM	Samsung
K4B1G0846G-BCF8	1Gb G-die DDR3 SDRAM	Samsung
K4B1G0846G-BCH9	1Gb G-die DDR3 SDRAM	Samsung

Part Number	Description
K4B1G0846D	1Gb D-die DDR3 SDRAM Specification
K4B1G0446C	1Gb C-die DDR3 SDRAM
K4B1G0446D	1Gb D-die DDR3 SDRAM Specification
K4B1G1646C	1Gb C-die DDR3 SDRAM
K4B1G1646D	1Gb D-die DDR3 SDRAM Specification
K4B2G0446D	2Gb D-die DDR3 SDRAM
K4B2G0846D	2Gb D-die DDR3 SDRAM
K4B2G1646C	2Gb C-die DDR3 SDRAM