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KA100O015E-BJTT - 2CKE DDP Mobile DDR SDRAM

General Description

The KA100O015E is a Multi Chip Package Memory which combines 4G bit NAND Flash Memory and 4G bit DDP synchronous high data rate Dynamic RAM.

NAND cell provides the most cost-effective solution for the solid state application market.

Key Features

  • Operating Temperature : -25°C ~ 85°C.
  • Package : 137-ball FBGA Type - 10.5 x 13 x 1.2mmt, 0.8mm pitch.
  • Voltage Supply - 1.8V Device : 1.7V ~ 1.95V.
  • Organization - Memory Cell Array : (256M + 8M) x 16bit for 4Gb (512M + 16M) x 16bit for 8Gb DDP - Data Register : (2K + 64) x 16bit.
  • Automatic Program and Erase - Page Program : (2K + 64)Word - Block Erase : (128K + 4K)Word.
  • Page Read Operation - Page Size : (2K + 64)Word - R.

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The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Rev. 1.0, Jul. 2010 KA100O015E-BJTT MCP Specification 4Gb (256M x16) NAND Flash + 4Gb (64M x32 + 64M x32) 2/CS,2CKE DDP Mobile DDR SDRAM datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise.