• Part: KBE00F005A-D411
  • Description: 512Mb NANDx2 + 256Mb Mobile SDRAMx2
  • Manufacturer: Samsung Semiconductor
  • Size: 1.32 MB
Download KBE00F005A-D411 Datasheet PDF
KBE00F005A-D411 page 2
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KBE00F005A-D411 Key Features

  • Operating Temperature : -25°C ~ 85°C
  • Package : 137ball FBGA Type
  • 10.5mmx13mm, 0.8mm pitch <NAND>
  • Power Supply Voltage : 2.5~ 2.9V
  • Organization
  • Memory Cell Array : (128M + 4096K)bit x 8 bit
  • Data Register : (512 + 16)bit x 8bit
  • Automatic Program and Erase
  • Page Program : (512 + 16)Byte
  • Block Erase : (16K + 512)Byte