KBE00S003M-D411 Overview
KBE00S003M-D411 MCP MEMORY MCP Specification 1Gb NAND 2 + 256Mb Mobile SDRAM 2 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS...
KBE00S003M-D411 Key Features
- Operating Temperature : -25°C ~ 85°C
- Package : 107-ball FBGA Type
- 12x14mm, 0.8mm pitch <NAND>
- Power Supply Voltage : 2.5~2.9V
- Organization
- Memory Cell Array : (256M + 8,192K)bits x 8bits
- Data Register : (512 + 16)bits x 8bits
- Automatic Program and Erase
- Page Program : (512 + 16)bits x 8bits
- Block Erase : (16K + 512)Bytes
KBE00S003M-D411 Applications
- Samsung Electronics reserves the right to change products or specification without notice