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KFG5616x1A-xxB5 - OneNAND Specification FLASH MEMORY

Description

10.

Revised Reset Parameters and Timing Diagrams.

1.

Features

  • including:.
  • A BootRAM and bootloader.
  • Two independent bi-directional 1KB DataRAM buffers.
  • A High-Speed x16 Host Interface.
  • On-chip Error Correction.
  • On-chip NOR interface controller This on-chip integration enables system designers to reduce external system logic and use high-density NAND Flash in.

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OneNAND256(KFG5616x1A-xxB5) FLASH MEMORY www.DataSheet4U.com OneNANDTM Specification Density Part No. KFG5616Q1A-DEB5 KFG5616Q1A-PEB5 KFG5616D1A-DEB5 KFG5616D1A-PEB5 KFG5616U1A-DIB5 KFG5616U1A-PIB5 VCC(core & IO) 1.8V(1.7V~1.95V) 1.8V(1.7V~1.95V) 2.65V(2.4V~2.9V) 2.65V(2.4V~2.9V) 3.3V(2.7V~3.6V) 3.3V(2.7V~3.6V) Temperature Extended Extended Extended Extended Industrial Industrial PKG 67FBGA(LF) 48TSOP1 67FBGA(LF) 48TSOP1 67FBGA(LF) 48TSOP1 256Mb Version: Ver. 1.1 Date: Aug 12, 2005 1 OneNAND256(KFG5616x1A-xxB5) FLASH MEMORY www.DataSheet4U.com 1.0 INTRODUCTION This specification contains information about the Samsung Electronics Company OneNAND™‚ Flash memory product family. Section 1.0 includes a general overview, revision history, and product ordering information.
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