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KFM1G16Q2M - MuxOneNAND FLASH MEMORY

General Description

is revised.

4.

Added Read while Load and Write While Program diagram.

Key Features

  • including:.
  • A BootRAM and bootloader.
  • Two independent bi-directional 2KB DataRAM buffers.
  • A High-Speed x16 Host Interface.
  • On-chip Error Correction.
  • On-chip NOR interface controller This on-chip integration enables system designers to reduce external system logic and use high-density NAND Flash in.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.DataSheet4U.com MuxOneNAND1G(KFM1G16Q2M-DEB5) MuxOneNAND2G(KFN2G16Q2M-DEB5) FLASH MEMORY MuxOneNANDTMSpecification Density 1Gb 2Gb Part No. KFM1G16Q2M-DEB5 KFN2G16Q2M-DEB5 VCC(core & IO) 1.8V(1.7V~1.95V) 1.8V(1.7V~1.95V) Temperature Extended Extended PKG 63FBGA(LF) 63FBGA(LF) Version: Ver. 1.0 Date: May 17th, 2005 1 www.DataSheet4U.com MuxOneNAND1G(KFM1G16Q2M-DEB5) MuxOneNAND2G(KFN2G16Q2M-DEB5) FLASH MEMORY 1.0 INTRODUCTION This specification contains information about the Samsung Electronics Company MuxOneNAND™‚ Flash memory product family. Section 1.0 includes a general overview, revision history, and product ordering information. Section 2.0 describes the MuxOneNAND device. Section 3.0 provides information about device operation.