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MR16R0826BN1 Datasheet

Manufacturer: Samsung Semiconductor

This datasheet includes multiple variants, all published together in a single manufacturer document.

MR16R0826BN1 datasheet preview

Datasheet Details

Part number MR16R0826BN1
Datasheet MR16R0826BN1 MR16R0824BN1 Datasheet (PDF)
File Size 37.77 KB
Manufacturer Samsung Semiconductor
Description (MR16R0824(6/8/C/G)BN1) RAMBUS MODULE
MR16R0826BN1 page 2 MR16R0826BN1 page 3

MR16R0826BN1 Overview

SERIAL PRESENCE DETECT MR16R0824(6/8/C/G)BN1 RAMBUS MODULE RIMM SPD Specification based on 128M RDRAM(B-die, 32s banks) Version 1.1 October 2000 Change History Version 1.1 (Oct. ′00) Based on the Samsung 128M RDRAM (A-die) SPD Specification 1.02 version. 2000 SERIAL PRESENCE DETECT MR16R0824(6/8)BN1-CK8/CK7/CG6.

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MR16R1622AF0 (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
MR16R1622DF0 (MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1624AF0 (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
MR16R1624DF0 (MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1624DF0 (MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1624GEG0 Key Timing Parameters

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