MR16R1624GEG0 Datasheet | Samsung Semiconductor

Overview The RIMM module is a general purpose high- performance memory module suitable for use in a broad range of applications including puter memory, personal puters, workstations and other applications where high bandwidth .. and low latency are required. The RIMM module consists of 256/288Mb devices. These are extremely high-speed CMOS DRAMs organized as 16M words by 16 or 18 bits. The use of Rambus Signaling Level (RSL) technology permits up to 1066 MHz transfer rates while using conventional system and board design technologies. RDRAM devices are capable of sustained data transfers at 0.94 ns per two bytes (7.5ns per 16 bytes). The RDRAM architecture enables the highest sustained bandwidth for multiple, simultaneous, randomly addressed, memory transactions. The separate control and data buses with independent row and column control yield over 95% bus efficiency. The RDRAM device's 32-bank architecture supports up to four simultaneous transactions per device. RDRAM Key Timing Parameters/Part Numbers The following table lists the frequency and latency bins available for RIMM modules. Table 1: Part Number by Freq. & Latency Speed Organization Bin t RAC I/O (Row Freq. Access (MHz) Time) ns 1066 800 800 1066 800 800 1066 800 800 32P 40 45 32P 40 45 32P 40 45 Part Number -CT9 64M x 16/18 -CM8 -CK8 -CT9 128M x 16/18 -CM8 -CK8 -CT9 256M x 16/18 -CM8 -CK8 MR16/18R1624EG0-CT9 MR16/18R1624EG0-CM8 MR16/18R1624EG0-CK8 MR16/18R1628EG0-CT9 MR16/18R1628EG0-CM8 MR16/18R1628EG0-CK8 MR16/18R162GEG0-CT9 MR16/18R162GEG0-CM8 MR16/18R162GEG0-CK8 Features - High speed up to 1066 MHz RDRAM storage - 184 edge connector pads with 1mm pad spacing - Module PCB size : 133.35mm x 31.75mm x 1.27mm Form Factor The RIMM modules are offered in 184-pad 1mm edge connector pad pitch suitable for 184 contact RIMM connectors. Figure 1 below, shows a sixteen device RIMM module. (5.25” x 1.25” x 0.05”) - 256Mb and 288Mb base PC800 RIMM Module - Module PCB size : 133.35mm x 34.93mm x 1.27mm...