• Part: MR186R1628AF0
  • Description: AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
  • Manufacturer: Samsung Semiconductor
  • Size: 419.61 KB
MR186R1628AF0 Datasheet (PDF) Download
Samsung Semiconductor
MR186R1628AF0

Key Features

  • 256M x 16/18
  • CN9 -CM8 -CK8
  • High speed up to 1066 MHz RDRAM storage
  • 184 edge connector pads with 1mm pad spacing
  • Module PCB size : 133.35mm x 31.75mm x 1.27mm
  • Module PCB size : 133.35mm x 34.93mm x 1.27mm
  • Each RDRAM device has 32 banks, for a total of 512, 256
  • Gold plated edge connector pad contacts
  • Serial Presence Detect(SPD) support
  • Operates from a 2.5 volt supply (±5%)