MR18R1624AF0 Datasheet PDF | Samsung semiconductor

Samsung semiconductor MR18R1624AF0

The RIMM module is a general purpose high- performance memory module suitable for use in a broad range of applications including computer memory, personal computers, workstations and other applications where high bandwidth and low latency are required. The RIMM module consists of 256/288Mb devices.

Part No.	MR18R1624AF0
Datasheet	MR18R1624AF0 Download
Manufacturer	Samsung semiconductor
Description	AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
Buy	Stock & Price

FEATURES

256M x 16/18 -CN9 -CM8 -CK8 ♦ High speed up to 1066 MHz RDRAM storage ♦ 184 edge connector pads with 1mm pad spacing ♦ Module PCB size : 133.35mm x 31.75mm x 1.27mm (5.25” x 1.25” x 0.05”) - 256Mb base RIMM Module ♦ Module PCB size : 133.35mm x 34.93mm x 1.27mm Form Factor The RIMM modules are offered in 184-pad 1mm edge connector pad pitch suitable for 184 contact RIMM connectors. Figure 1 below, shows a sixteen device RIMM module. (5.25” x 1.375” x 0.05”) - 288Mb base RIMM Module ♦ Each RDRAM device has 32 banks, for a total of 512, 256, 128, 64 banks on each 512/576MB, 256/288MB, 128/144MB, 64/72MB module respectively ♦ Gold plated edge connector pad contacts ♦ Serial Presence Detect(SPD) support ♦ Operates from a 2.5 volt supply (±5%) ♦ Powerdown self refresh modes ♦ Separate Row and Column buses for higher efficiency ♦ WBGA package (92 balls) Note: On double sided modules, RDRAM devices are also installed on bottom side of PCB. Figure 1: RIMM Module shown with heat spread...