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CIB10P260 - Chip Bead

Download the CIB10P260 datasheet PDF. This datasheet also covers the CIB variant, as both devices belong to the same chip bead family and are provided as variant models within a single manufacturer datasheet.

General Description

Part no.

Key Features

  • Perfect shape for automatic mounting, with no directionality.
  • Excellent solderability and high heat resistance for either flow or reflow soldering.
  • Monolithic inorganic material construction for high reliability.
  • Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (CIB-10P100.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Part Number Description Manufacturer

Other Datasheets by Samsung Semiconductor

Part Number Description
CIB10P220 Chip Bead
CIB10P100 Chip Bead
CIB10P300 Chip Bead
CIB10P330 Chip Bead
CIB10J300 Chip Bead

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Chip Bead For EMI Suppression 201208 CIB/CIM10 Series (1608/ EIA 0603) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES  Perfect shape for automatic mounting, with no directionality.  Excellent solderability and high heat resistance for either flow or reflow soldering  Monolithic inorganic material construction for high reliability  Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. DIMENSION RECOMMENDED LAND PATTERN 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm Type Dimension [mm] LW t d 10 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2 DESCRIPTION Part no.