• Part: CIM03J241
  • Description: Chip Bead
  • Manufacturer: Samsung Semiconductor
  • Size: 1.05 MB
Download CIM03J241 Datasheet PDF
CIM03J241 page 2
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Datasheet Summary

Chip Bead ; CIB/CIM Series For EMI Suppression Feature Smallest beads suitable for surface mounting Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering. Monolithic inorganic material construction for high reliability. Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. Application High frequency EMI prevention application to puters, printers, VCRs, TVs and mobile phones. The CIB/CIM Series are used for EMI suppression filter. These beads suppress electro-magnetic wave noise by increased impedance, especially by increased resistance at noise...