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CIM10J102

CIM10J102 is Chip Bead manufactured by Samsung Semiconductor.
CIM10J102 datasheet preview

CIM10J102 Datasheet

Part number CIM10J102
Download CIM10J102 Datasheet PDF
File Size 750.18 KB
Manufacturer Samsung Semiconductor
Description Chip Bead
CIM10J102 page 2 CIM10J102 page 3

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Samsung Semiconductor datasheets

CIM10J102 Description

Multi-layer type B:Mono-layer type (3) Dimension (4) Material Code (5) Nominal impedance (121:120Ω, 202:2000Ω ) (6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) (7) Packaging(C:paper tape, E:embossed tape) REMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Card Board Taping Quantity(pcs/reel) 4000 NOTICE :All specifications are subject to change...

CIM10J102 Key Features

  • Perfect shape for automatic mounting, with no directionality
  • Excellent solderability and high heat resistance for either flow or
  • Monolithic inorganic material construction for high reliability
  • Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs
  • NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or
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