Download the CIM10U301 datasheet PDF.
This datasheet also covers the CIB variant, as both devices belong to the same chip bead family and are provided as variant models within a single manufacturer datasheet.
General Description
Part no.
Key Features
Perfect shape for automatic mounting, with no directionality.
Excellent solderability and high heat resistance for either flow or
reflow soldering.
Monolithic inorganic material construction for high reliability.
Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs.
Full PDF Text Transcription for CIM10U301 (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
CIM10U301. For precise diagrams, and layout, please refer to the original PDF.
Chip Bead For EMI Suppression 201208 CIB/CIM10 Series (1608/ EIA 0603) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile ...
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I prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering Monolithic inorganic material construction for high reliability Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. DIMENSION RECOMMENDED LAND PATTERN 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm Type Dimension [mm] LW t d 10 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2 DESCRIPTION Part no.
CIM10U301 Datasheet
