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K4A4G165WE Datasheet 4gb E-die Ddr4 Sdram

Manufacturer: Samsung Semiconductor

Overview: Rev. 1.4, Jun. 2016 K4A4G165WE 4Gb E-die DDR4 SDRAM x16 only 96FBGA with Lead-Free & Halogen-Free (RoHS pliant) 1.2V datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. (C) 2016 Samsung Electronics Co., Ltd.GG All rights reserved. -1- K4A4G165WE datasheet Rev. 1.4 DDR4 SDRAM Revision History Revision No. 1.0 1.1 1.2 1.3 1.4 History - First SPEC release - Addition of values on page 10 [Table 5] - Addition of Industrial temp - Correction of typo - Addition of DDR4-2666 Draft Date 19th Oct. 2015 27th Oct. 2015 11th Apr. 2016 27th May. 2016 28th Jun. 2016 Remark - Editor J.Y.Lee J.Y.Lee J.Y.Lee J.Y.Lee J.Y.Lee -2- K4A4G165WE datasheet Rev. 1.4 DDR4 SDRAM Table Of Contents 4Gb E-die DDR4 SDRAM x16 only 1. Ordering Information .....................................................................................................................................................4 2.

Key Features

  • 3. Package pinout/Mechanical Dimension & Addressing5 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package 5 3.2 FBGA Package Dimension (x16) 6 4. Input/Output Functional.

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