K4A8G165WC Description
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K4A8G165WC Key Features
- 6 3.1 x16 Package Pinout (Top view): 96ball FBGA Package
- 6 3.2 FBGA Package Dimension (x16)
- Part: K4A8G165WC
- Manufacturer: Samsung Semiconductor
- Size: 741.54 KB
Related Samsung Semiconductor Datasheets
| Part Number | Description |
|---|---|
| K4A8G165WB | 8Gb B-die DDR4 SDRAM |
| K4A8G045WB | 8Gb B-die DDR4 SDRAM |
| K4A8G085WB | 8Gb B-die DDR4 SDRAM |
| K4A4G045WD | 4Gb D-die DDR4 SDRAM |
| K4A4G045WE | 4Gb E-die DDR4 SDRAM |