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K4B2G1646F Datasheet 2gb F-die Ddr3l Sdram X16

Manufacturer: Samsung Semiconductor

Overview: Rev. 1.0, Feb. 2016 K4B2G1646F 2Gb F-die DDR3L SDRAM x16 96FBGA with Lead-Free & Halogen-Free (RoHS pliant) 1.35V datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. གྷ 2016 Samsung Electronics Co., Ltd.GG All rights reserved. -1- K4B2G1646F Revision History Revision No. 1.0 - First SPEC release datasheet Rev. 1.0 DDR3L SDRAM History Draft Date 16th Feb. 2016 Remark - Editor J.Y.Lee -2- K4B2G1646F datasheet Rev. 1.0 DDR3L SDRAM Table Of Contents 2Gb F-die DDR3L SDRAM Only x16 1. Ordering Information .....................................................................................................................................................5 2.

Key Features

  • 3. Package pinout/Mechanical Dimension & Addressing6 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package 6 3.2 FBGA Package Dimension (x16) 7 4. Input/Output Functional.

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