Datasheet4U Logo Datasheet4U.com

K4B4G1646B - 4Gb B-die DDR3 SDRAM

Description

8 5.

DDR3 SDRAM Addressing 9 6.

Absolute Maximum Ratings 10 6.1 Absolute Maximum DC Ratings 10 6.2 DRAM Component Operating Temperature Range 10 7.

Features

  • 5 3. Package pinout/Mechanical Dimension & Addressing 6 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package 6 3.2 FBGA Package Dimension (x16) 7 4. Input/Output Functional.

📥 Download Datasheet

Datasheet preview – K4B4G1646B

Datasheet Details

Part number K4B4G1646B
Manufacturer Samsung
File Size 1.88 MB
Description 4Gb B-die DDR3 SDRAM
Datasheet download datasheet K4B4G1646B Datasheet
Additional preview pages of the K4B4G1646B datasheet.

📁 Similar Datasheet

  • K4B1G0446C - 1Gb C-die DDR3 SDRAM (Samsung semiconductor)
  • K4B1G0446D - 1Gb D-die DDR3 SDRAM Specification (Samsung semiconductor)
  • K4B1G0846C - 1Gb C-die DDR3 SDRAM (Samsung semiconductor)
  • K4B1G0846D - 1Gb D-die DDR3 SDRAM Specification (Samsung semiconductor)
  • K4B1G1646C - 1Gb C-die DDR3 SDRAM (Samsung semiconductor)
  • K4B1G1646D - 1Gb D-die DDR3 SDRAM Specification (Samsung semiconductor)
  • K4B2G0446D - 2Gb D-die DDR3 SDRAM (Samsung semiconductor)
  • K4B2G0846D - 2Gb D-die DDR3 SDRAM (Samsung semiconductor)
  • K4B2G1646C - 2Gb C-die DDR3 SDRAM (Samsung semiconductor)
Other Datasheets by Samsung

Full PDF Text Transcription

Click to expand full text
Rev. 1.0, Jan. 2012 K4B4G1646B 4Gb B-die DDR3 SDRAM Olny x16 96FBGA with Lead-Free & Halogen-Free (RoHS compliant) www.DataSheet.net/ datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise.
Published: |