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K4B8G1646Q - DDP 8Gb Q-die DDR3L SDRAM

General Description

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Key Features

  • 5 3. Package pinout/Mechanical Dimension & Addressing 6 3.1 x16 DDP Package Pinout (Top view) : 96ball FBGA Package 6 3.2 Stacked / Dual - die DDR3 SDRAM x16 Ballout 7 3.3 FBGA Package Dimension (x16) 8 4. Input/Output Functional.

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Full PDF Text Transcription for K4B8G1646Q (Reference)

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Rev. 1.0, Oct. 2013 K4B8G1646Q DDP 8Gb Q-die DDR3L SDRAM 96FBGA with Lead-Free & Halogen-Free (RoHS compliant) 1.35V datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO C...

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compliant) 1.35V datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise.

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