K4W2G1646C - 2Gb gDDR3 SDRAM C-die

Description

Features

6 3. Package pinout/Mechanical Dimension & Addressing 7 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package 7 3.2 FBGA Package Dimension (x16) 8 4. Input/Output Functional.

Samsung

📥 Download Datasheet

Datasheet Details

Part number	K4W2G1646C
Manufacturer	Samsung
File Size	2.63 MB
Description	2Gb gDDR3 SDRAM C-die
Datasheet	K4W2G1646C Datasheet
Additional preview pages of the K4W2G1646C datasheet.

📁 Similar Datasheet

Other Datasheets by Samsung

K4W1G1646E - 1Gb gDDR3 SDRAM E-die

Full PDF Text Transcription

Click to expand full text

Rev. 1.1, Sep. 2010 K4W2G1646C 2Gb gDDR3 SDRAM C-die 96FBGA with Lead-Free & Halogen-Free (RoHS compliant) datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise.

Published: Mar 24, 2016 |