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K4W2G1646C - 2Gb gDDR3 SDRAM C-die

General Description

5.

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Key Features

  • 6 3. Package pinout/Mechanical Dimension & Addressing 7 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package 7 3.2 FBGA Package Dimension (x16) 8 4. Input/Output Functional.

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Full PDF Text Transcription for K4W2G1646C (Reference)

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Rev. 1.1, Sep. 2010 K4W2G1646C 2Gb gDDR3 SDRAM C-die 96FBGA with Lead-Free & Halogen-Free (RoHS compliant) datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PROD...

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liant) datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise.

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